forked from luck/tmp_suning_uos_patched
hwmon: New Winbond W83793 hardware monitoring driver
Add support for the W83793 hardware monitoring chip. This driver was originally contributed by Yuan Mu of Winbond Electronics Corp. Signed-off-by: Rudolf Marek <r.marek@assembler.cz> Signed-off-by: Jean Delvare <khali@linux-fr.org>
This commit is contained in:
parent
7188cc66b4
commit
6800c3d027
|
@ -488,6 +488,16 @@ config SENSORS_W83792D
|
|||
This driver can also be built as a module. If so, the module
|
||||
will be called w83792d.
|
||||
|
||||
config SENSORS_W83793
|
||||
tristate "Winbond W83793"
|
||||
depends on HWMON && I2C && EXPERIMENTAL
|
||||
help
|
||||
If you say yes here you get support for the Winbond W83793
|
||||
hardware monitoring chip.
|
||||
|
||||
This driver can also be built as a module. If so, the module
|
||||
will be called w83793.
|
||||
|
||||
config SENSORS_W83L785TS
|
||||
tristate "Winbond W83L785TS-S"
|
||||
depends on HWMON && I2C && EXPERIMENTAL
|
||||
|
|
|
@ -9,6 +9,7 @@ obj-$(CONFIG_HWMON_VID) += hwmon-vid.o
|
|||
obj-$(CONFIG_SENSORS_ASB100) += asb100.o
|
||||
obj-$(CONFIG_SENSORS_W83627HF) += w83627hf.o
|
||||
obj-$(CONFIG_SENSORS_W83792D) += w83792d.o
|
||||
obj-$(CONFIG_SENSORS_W83793) += w83793.o
|
||||
obj-$(CONFIG_SENSORS_W83781D) += w83781d.o
|
||||
obj-$(CONFIG_SENSORS_W83791D) += w83791d.o
|
||||
|
||||
|
|
1609
drivers/hwmon/w83793.c
Normal file
1609
drivers/hwmon/w83793.c
Normal file
File diff suppressed because it is too large
Load Diff
Loading…
Reference in New Issue
Block a user