forked from luck/tmp_suning_uos_patched
a8892d8389
When registering a thermal zone device using platform information via bind_params, the thermal framework will always perform the cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT). This patch changes the data structures so that it is possible to inform what are the desired limits for each trip point inside a bind_param. The way the binding is performed is also changed so that it uses the new data structure. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> |
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cpu-cooling-api.txt | ||
exynos_thermal | ||
exynos_thermal_emulation | ||
intel_powerclamp.txt | ||
nouveau_thermal | ||
sysfs-api.txt | ||
x86_pkg_temperature_thermal |