kernel_optimize_test/Documentation/thermal
Eduardo Valentin a8892d8389 thermal: thermal_core: allow binding with limits on bind_params
When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:10:24 -04:00
..
cpu-cooling-api.txt thermal: add generic cpufreq cooling implementation 2012-09-24 14:44:38 +08:00
exynos_thermal Documentation: thermal: Explain the exynos thermal driver model 2013-08-13 09:52:04 -04:00
exynos_thermal_emulation doc: fix misspellings with 'codespell' tool 2013-05-28 12:02:12 +02:00
intel_powerclamp.txt PM: Introduce Intel PowerClamp Driver 2013-02-06 13:45:00 +08:00
nouveau_thermal drm/nouveau/hwmon: s/fan0/fan1/ 2013-02-20 16:00:25 +10:00
sysfs-api.txt thermal: thermal_core: allow binding with limits on bind_params 2013-09-03 09:10:24 -04:00
x86_pkg_temperature_thermal Thermal: Documentation for x86 package temperature thermal driver 2013-06-18 06:27:57 +08:00