kernel_optimize_test/drivers/thermal/ti-soc-thermal
Kapileshwar Singh 6cd9e9f629 thermal: of: fix cooling device weights in device tree
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be.  The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:50 -07:00
..
dra752-bandgap.h thermal: ti-soc-thermal: add thermal data for DRA752 chips 2013-06-13 10:15:52 +08:00
dra752-thermal-data.c thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensors 2013-08-29 09:36:13 -04:00
Kconfig thermal: ti-soc-thermal: add thermal data for DRA752 chips 2013-06-13 10:15:52 +08:00
Makefile thermal: ti-soc-thermal: add thermal data for DRA752 chips 2013-06-13 10:15:52 +08:00
omap4-thermal-data.c
omap4xxx-bandgap.h
omap5-thermal-data.c
omap5xxx-bandgap.h
ti-bandgap.c thermal: ti-soc-thermal: bandgap: Fix build warning if !CONFIG_PM_SLEEP 2015-02-24 14:06:05 -04:00
ti-bandgap.h thermal: ti-soc-thermal: add dra752 chip to device table 2013-06-13 10:16:07 +08:00
ti-thermal-common.c thermal: of: fix cooling device weights in device tree 2015-05-04 21:27:50 -07:00
ti-thermal.h thermal: ti-soc-thermal: add thermal data for DRA752 chips 2013-06-13 10:15:52 +08:00
TODO