forked from luck/tmp_suning_uos_patched
724adec33c
Package temperature sensors are actually implemented in hardware per-die. Thus, the new multi-die/package systems sport mulitple package thermal zones for each package. Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose multiple zones per package, instead of just one. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com |
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| .. | ||
| int340x_thermal | ||
| intel_bxt_pmic_thermal.c | ||
| intel_pch_thermal.c | ||
| intel_powerclamp.c | ||
| intel_quark_dts_thermal.c | ||
| intel_soc_dts_iosf.c | ||
| intel_soc_dts_iosf.h | ||
| intel_soc_dts_thermal.c | ||
| Kconfig | ||
| Makefile | ||
| x86_pkg_temp_thermal.c | ||