Len Brown b2ce1c883d thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages ... Syntax update only -- no logical or functional change. In response to the new multi-die/package changes, update variable names to use the more generic thermal "zone" terminology, instead of "package", as the zones can refer to either packages or die. Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Cc: Zhang Rui <rui.zhang@intel.com> Link: https://lkml.kernel.org/r/b65494a76be13481dc3a809c75debb2574c34eda.1557769318.git.len.brown@intel.com		2019-05-23 10:08:36 +02:00
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broadcom	thermal: broadcom: Remove ACPI support	2019-05-14 07:00:37 -07:00
intel	thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages	2019-05-23 10:08:36 +02:00
qcom	Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux	2019-05-16 16:16:18 -07:00
samsung	thermal: samsung: Fix incorrect check after code merge	2019-03-18 22:11:06 +08:00
st	thermal: stm32: simplify getting .driver_data	2019-05-13 20:35:35 -07:00
tegra	drivers: thermal: Kconfig: pedantic cleanups	2019-05-13 20:35:34 -07:00
ti-soc-thermal	thermal: ti-soc-thermal: remove dead code	2018-07-27 14:43:01 -07:00
armada_thermal.c	Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal	2019-01-05 16:01:16 -08:00
clock_cooling.c
cpu_cooling.c	thermal: cpu_cooling: Actually trace CPU load in thermal_power_cpu_get_power	2019-05-14 07:00:41 -07:00
da9062-thermal.c	thermal: da9062/61: Prevent hardware access during system suspend	2018-10-25 10:44:55 -07:00
db8500_thermal.c
devfreq_cooling.c
dove_thermal.c
fair_share.c
gov_bang_bang.c
hisi_thermal.c	thermal/drivers/hisi: Fix number of sensors on hi3660	2018-12-10 20:13:09 -08:00
imx_thermal.c	thermal: imx: save one condition block for normal case of nvmem initialization	2019-01-02 04:47:12 -08:00
Kconfig	Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux	2019-05-16 16:16:18 -07:00
kirkwood_thermal.c
Makefile	thermal: Introduce Amazon's Annapurna Labs Thermal Driver	2019-05-14 07:00:26 -07:00
max77620_thermal.c
mtk_thermal.c	thermal: mtk: Allocate enough space for mtk_thermal.	2019-03-18 22:23:10 +08:00
of-thermal.c	of: thermal: Improve print information	2019-05-13 20:35:34 -07:00
power_allocator.c
qoriq_thermal.c	thermal: qoriq: Remove unnecessary DT node is NULL check	2019-05-14 07:00:27 -07:00
rcar_gen3_thermal.c	thermal: rcar_gen3_thermal: Fix to show correct trip points number	2019-05-14 07:00:43 -07:00
rcar_thermal.c	thermal: rcar_thermal: update calculation formula for R-Car Gen3 SoCs	2019-05-14 07:00:42 -07:00
rockchip_thermal.c	thermal: rockchip: Support the PX30 SoC in thermal driver	2019-05-14 07:00:40 -07:00
spear_thermal.c	thermal: spear_thermal: simplify getting .driver_data	2018-11-30 16:46:56 +08:00
step_wise.c
tango_thermal.c
thermal_core.c	Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux	2019-05-16 16:16:18 -07:00
thermal_core.h
thermal_helpers.c
thermal_hwmon.c	thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info	2018-07-27 14:43:21 -07:00
thermal_hwmon.h	thermal: hwmon: inline helpers when CONFIG_THERMAL_HWMON is not set	2019-01-02 04:43:00 -08:00
thermal_mmio.c	thermal: Introduce Amazon's Annapurna Labs Thermal Driver	2019-05-14 07:00:26 -07:00
thermal_sysfs.c	thermal: Fix locking in cooling device sysfs update cur_state	2018-11-30 16:57:51 +08:00
thermal-generic-adc.c	thermal: generic-adc: make lookup table optional	2019-05-14 07:00:28 -07:00
uniphier_thermal.c	thermal: uniphier: Convert to SPDX identifier	2019-01-02 04:47:16 -08:00
user_space.c
zx2967_thermal.c	thermal: zx2967_thermal: simplify getting .driver_data	2018-11-30 16:46:57 +08:00